Gold Member Since 2016
Audited Supplier
Ucreate PCB Co., Ltd.

PCB, PCBA, 4 Layer Board manufacturer / supplier in China, offering Great Quality PCB Supplier with ISO9001, Fr4 94V0 Printed Circuit Board with UL ISO9001 RoHS, Single Side Ceramics PCB Used in LED and Power Electronics and so on.

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Great Quality PCB Supplier with ISO9001

FOB Price: US $0.1 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US $0.1/ Piece
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Production Capacity: 20000 Sqm/Month
Transport Package: Vacuum Package
Payment Terms: L/C, T/T, Paypal

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Basic Info
  • Model NO.: UC-57456
  • Dielectric: FR-4
  • Application: Consumer Electronics
  • Mechanical Rigid: Rigid
  • Base Material: Copper
  • Brand: Uc
  • Base Material Type: Fr4
  • Finished Copper Thickness: All 1oz
  • Solder Mask Color: Green/White/Black/Blue/Red
  • Fast Turn: 2 Working Days
  • Trademark: UC
  • Origin: Shenzhen, China
  • Type: Rigid Circuit Board
  • Material: Fiberglass Epoxy
  • Flame Retardant Properties: V0
  • Processing Technology: Electrolytic Foil
  • Insulation Materials: Organic Resin
  • Board Layer: 1-24
  • Material Finished Thickness: 1.6mm
  • Surface Treatment: Immersion Gold/HASL Lead Free/OPS/ Immersion Silve
  • Lead Time: 5 Working Days
  • Ipc Standards: Ipc Class II
  • Specification: UL(US&Canada). ISO. RoHs, TS, SGS
  • HS Code: 8534009000
Product Description
Technical Capabilities
ItemsSpeci.Remark
Max panel size32" x 20.5"(800mm x 520mm) 
Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm) 
Min PAD (inner layer)5 mil(0.13mm)hole ring width
Min thickness(inner layer)4 mil(0.1mm)without copper
Inner copper thickness1~4 oz 
Outer copper thickness0.5~6 oz 
Finished board thickness0.4-3.2 mm 

Board thickness tolerance control
±0.10 mm±0.10 mm1~4 L
±10%±10%6~8 L
±10%±10%≥10 L
Inner layer treatmentbrown oxidation 
Layer count Capability1-30 LAYER 
alignment between ML±2mil 
Min drilling0.15 mm 
Min finished hole0.1 mm 
Hole precision±2 mil(±50 um) 
tolerance for Slot±3 mil(±75 um) 
tolerance for PTH±3 mil(±75um) 
tolerance for NPTH±2mil(±50um) 
Max Aspect Ratio for PTH8:1 
Hole wall copper thickness15-50um 
Alignment of outer layers4mil/4mil 
Min trace width/space for outer layer4mil/4mil 
Tolerance of Etching+/-10% 
Thickness of solder maskon trace0.4-1.2mil(10-30um) 
at trace corner≥0.2mil(5um) 
On base material≤+1.2mil
  Finished thickness
 
Hardness of solder mask6H 
Alignment of solder mask film±2mil(+/-50um) 
Min width of solder mask bridge4mil(100um) 
Max hole with solder plug0.5mm 
Surface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. 
Max Nickel thickness for Gold finger280u"(7um) 
Max gold thickness for Gold finger30u"(0.75um) 
Nickel thickness in Immersion Gold120u"/240u"(3um/6um) 
Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um) 
Impedance control and its tolerance50±10%,75±10%,100±10% 110±10% 
Trace Anti-stripped strength≥61B/in(≥107g/mm) 
bow and twist0.75% 
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