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The Most Professional PCB Fabrication with UL

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Diamond Member Since 2016

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Rating: 5.0/5
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Basic Info.

Model NO.
uc-3574
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Brand
Uc
Board Thickness
1.6mm
Surface Treatment
HASL Lead Free/Immersion Gold/Immersion Silver
Finised Copper Thcikness
35/35/35/35um
Solder Mask Color
Green/White/Black/Blue/Red
Ipc Standards
Ipc Class 3
Lead Time
7 Working Days
Transport Package
Vacuum Package
Specification
UL(US&Canada). ISO. RoHs, TS, SGS
Trademark
UC
Origin
Shenzhen, China
HS Code
8534001000
Production Capacity
20000 Sqm/Month

Product Description

                                                        Ucreate LTD PCB's aim
 
                   Customer Satisfaction is Always Our First Priority!

 
 *Quality Policy 

           *Top Quality and high efficiency

                     *Improve continuously

                             *Achieve customer's satisfaction

 

1.Products Application

The Most Professional PCB Fabrication with UL


 

2. Market Distribution
 
The Most Professional PCB Fabrication with UL
 
 
3.Technical Capabilities
ItemsSpeci.Remark
Max panel size32" x 20.5"(800mm x 520mm) 
Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm) 
Min PAD (inner layer)5 mil(0.13mm)hole ring width
Min thickness(inner layer)4 mil(0.1mm)without copper
Inner copper thickness1~4 oz 
Outer copper thickness0.5~6 oz 
Finished board thickness0.4-3.2 mm 

Board thickness tolerance control
±0.10 mm±0.10 mm1~4 L
±10%±10%6~8 L
±10%±10%≥10 L
Inner layer treatmentbrown oxidation 
Layer count Capability1-30 LAYER 
alignment between ML±2mil 
Min drilling0.15 mm 
Min finished hole0.1 mm 
Hole precision±2 mil(±50 um) 
tolerance for Slot±3 mil(±75 um) 
tolerance for PTH±3 mil(±75um) 
tolerance for NPTH±2mil(±50um) 
Max Aspect Ratio for PTH8:1 
Hole wall copper thickness15-50um 
Alignment of outer layers4mil/4mil 
Min trace width/space for outer layer4mil/4mil 
Tolerance of Etching+/-10% 
Thickness of solder maskon trace0.4-1.2mil(10-30um) 
at trace corner≥0.2mil(5um) 
On base material≤+1.2mil
  Finished thickness
 
Hardness of solder mask6H 
Alignment of solder mask film±2mil(+/-50um) 
Min width of solder mask bridge4mil(100um) 
Max hole with solder plug0.5mm 
Surface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. 
Max Nickel thickness for Gold finger280u"(7um) 
Max gold thickness for Gold finger30u"(0.75um) 
Nickel thickness in Immersion Gold120u"/240u"(3um/6um) 
Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um) 
Impedance control and its tolerance50±10%,75±10%,100±10% 110±10% 
Trace Anti-stripped strength≥61B/in(≥107g/mm) 
bow and twist
 
0.75% 
 
4.Products Equipment

    The Most Professional PCB Fabrication with UL

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Contact Supplier

360° Virtual Tour

Diamond Member Since 2016

Suppliers with verified business licenses

Rating: 5.0/5
Manufacturer/Factory
Management System Certification
ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Terms of Payment
LC, T/T, D/P, PayPal, Western Union