| Structure: | Multilayer Rigid PCB |
|---|---|
| Dielectric: | FR-4 |
| Material: | Polyester Glass Fiber Mat Laminate |
| Application: | Consumer Electronics |
| Flame Retardant Properties: | V0 |
| Processing Technology: | Electrolytic Foil |
| Customization: |
|---|
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Audited Supplier 
| Files | Gerber, Protel, Powerpcb, Autocad, Cam350, etc |
| Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic) |
| Layer No. | 1 - 30 Layers |
| Board thickness | 0.0075"(0.2mm)-0.125"(3.2mm) |
| Board Thickness Tolerance | ±10% |
| Copper thickness | 0.5OZ - 4OZ |
| Impedance Control | ±10% |
| Warpage | 0.075%-1.5% |
| Peelable | 0.012"(0.3mm)-0.02'(0.5mm) |
| Min Trace Width (a) | 0.005"(0.125mm) |
| Min Space Width (b) | 0.005"(0.125mm) |
| Min Annular Ring | 0.005"(0.125mm) |
| SMD Pitch (a) | 0.012"(0.3mm) |
| pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027"(0.675mm) |
| Regesiter torlerance | 0.05mm |
| Min Solder Mask Dam (a) | 0.005"(0.125mm) |
| Soldermask Clearance (b) | 0.005"(0.125mm) |
| Min SMT Pad spacing (c) | 0.004"(0.1mm) |
| Solder Mask Thickness | 0.0007"(0.018mm) |
| Hole size | 0.01"(0.25mm)-- 0.257"(6.5mm) |
| Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |
| Aspect Ratio | 6:01 |
| Hole Registration | 0.004"(0.1mm) |
| HASL | 2.5um |
| Lead free HASL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-3u'' |
| OSP | 0.2-0.5um |
| Panel Outline Tol (+/-) | ±0.004''(±0.1mm) |
| Beveling | 30°45° |
| V-cut | 15° 30° 45° 60° |
| Surface finish | HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
| Certificate | ROHS ISO9001:2000 TS16949 SGS UL |
| Special requirements | Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger |
Suppliers with verified business licenses
Audited Supplier 
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