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2.4mm Board Thickness Rigid PCB with Multilayer

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Diamond Member Since 2016

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Rating: 5.0/5
Manufacturer/Factory

Basic Info.

Model NO.
UC018
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Brand
Uc
Surface Finish
Enig/2u′′
Soldermask Color
Green
Transport Package
Vacuum Package
Specification
UL, ROHS, ISO, TS, SGS
Trademark
UC
Origin
Shenzhen, China
HS Code
85340090
Production Capacity
20000sqm/Month

Product Description


Ucreate is specialized in low to medium volume high quality PCB population with UL&ISO&RoHs certificate approved.
 
Our Specialities: 
1. No MOQ
2. Quick Lead time
3. High standard pcb depends on IPC Class II or IPC Class III if required
4. 100% E-tested guarantee before shipping
5. RoHS, UL, ISO, SGS certificate approved
 
Our capabilities:
 
Items Speci.
Max panel size 32" x 20.5"(800mm x 520mm)
Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer) 5 mil(0.13mm)
Min thickness(inner layer) 4 mil(0.1mm)
Inner copper thickness 1~4 oz
Outer copper thickness 0.5~6 oz
Finished board thickness 0.4-3.2 mm

Board thickness tolerance control
±0.10 mm ±0.10 mm
±10% ±10%
±10% ±10%
Inner layer treatment brown oxidation
Layer count Capability 1-30 LAYER
alignment between ML ±2mil
Min drilling 0.15 mm
Min finished hole 0.1 mm
Hole precision ±2 mil(±50 um)
tolerance for Slot ±3 mil(±75 um)
tolerance for PTH ±3 mil(±75um)
tolerance for NPTH ±2mil(±50um)
Max Aspect Ratio for PTH 8:1
Hole wall copper thickness 15-50um
Alignment of outer layers 4mil/4mil
Min trace width/space for outer layer 4mil/4mil
Tolerance of Etching +/-10%
Thickness of solder mask on trace 0.4-1.2mil(10-30um)
at trace corner ≥0.2mil(5um)
On base material ≤+1.2mil
  Finished thickness
Hardness of solder mask 6H
Alignment of solder mask film ±2mil(+/-50um)
Min width of solder mask bridge 4mil(100um)
Max hole with solder plug 0.5mm
Surface finish HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger 280u"(7um)
Max gold thickness for Gold finger 30u"(0.75um)
Nickel thickness in Immersion Gold 120u"/240u"(3um/6um)
Gold thickness in Immersion Gold 2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance 50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength ≥61B/in(≥107g/mm)
bow and twist
 
0.75%

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360° Virtual Tour

Diamond Member Since 2016

Suppliers with verified business licenses

Rating: 5.0/5
Manufacturer/Factory
Management System Certification
ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Terms of Payment
LC, T/T, D/P, PayPal, Western Union