94V0 PCB Board with RoHS for Power Bank

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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  • 94V0 PCB Board with RoHS for Power Bank
  • 94V0 PCB Board with RoHS for Power Bank
  • 94V0 PCB Board with RoHS for Power Bank
  • 94V0 PCB Board with RoHS for Power Bank
  • 94V0 PCB Board with RoHS for Power Bank
  • 94V0 PCB Board with RoHS for Power Bank
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Basic Info.

Model NO.
UC-16062506
Material
Fiberglass Epoxy
Application
Aerospace
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Immersional Gold
Base Material
Copper
Insulation Materials
Organic Resin
Brand
Ucreate PCB
Board Thickness
1.2~2.0mm
Surface Finihsing
Immersional Gold
Lead Time
6-8 Working Days
Certificate
ISO,UL,RoHS
PCB Testing
E-Testing; Flying Probe Testing
Mask Ink Color
White/Black/Green/Red/Yellow/Blue
Color
Green Blue Red
Number of Layers
Multilayer
Copper Thickness
2oz
Condition
Original Made
Transport Package
Vacuum Packing
Specification
IPC-Class 2
Trademark
Ucreate PCB
Origin
Shenzhen China
HS Code
85340090
Production Capacity
5000sq. M/Month

Product Description


 
                                        Ucreate PCB CO.,LTD's Aim
 
                   Customer Satisfaction is Always Our First Priority!

 *Quality Policy 

           *Top Quality and high efficiency

                     *Improve continuously

                             *Achieve customer's satisfaction
 


1.Products Application

94V0 PCB Board with RoHS for Power Bank


2. Market Distribution
 
94V0 PCB Board with RoHS for Power Bank
 
 
3.Technical Capabilities
Items Speci. Remark
Max panel size 32" x 20.5"(800mm x 520mm)  
Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm)  
Min PAD (inner layer) 5 mil(0.13mm) hole ring width
Min thickness(inner layer) 4 mil(0.1mm) without copper
Inner copper thickness 1~4 oz  
Outer copper thickness 0.5~6 oz  
Finished board thickness 0.4-3.2 mm  

Board thickness tolerance control
±0.10 mm ±0.10 mm 1~4 L
±10% ±10% 6~8 L
±10% ±10% ≥10 L
Inner layer treatment brown oxidation  
Layer count Capability 1-30 LAYER  
alignment between ML ±2mil  
Min drilling 0.15 mm  
Min finished hole 0.1 mm  
Hole precision ±2 mil(±50 um)  
tolerance for Slot ±3 mil(±75 um)  
tolerance for PTH ±3 mil(±75um)  
tolerance for NPTH ±2mil(±50um)  
Max Aspect Ratio for PTH 8:1  
Hole wall copper thickness 15-50um  
Alignment of outer layers 4mil/4mil  
Min trace width/space for outer layer 4mil/4mil  
Tolerance of Etching +/-10%  
Thickness of solder mask on trace 0.4-1.2mil(10-30um)  
at trace corner ≥0.2mil(5um)  
On base material ≤+1.2mil
  Finished thickness
 
Hardness of solder mask 6H  
Alignment of solder mask film ±2mil(+/-50um)  
Min width of solder mask bridge 4mil(100um)  
Max hole with solder plug 0.5mm  
Surface finish HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.  
Max Nickel thickness for Gold finger 280u"(7um)  
Max gold thickness for Gold finger 30u"(0.75um)  
Nickel thickness in Immersion Gold 120u"/240u"(3um/6um)  
Gold thickness in Immersion Gold 2u"/6u"(0.05um/0.15um)  
Impedance control and its tolerance 50±10%,75±10%,100±10% 110±10%  
Trace Anti-stripped strength ≥61B/in(≥107g/mm)  
bow and twist
 
0.75%  
 
4.Products Equipment
    
94V0 PCB Board with RoHS for Power Bank
Certificates:
94V0 PCB Board with RoHS for Power Bank
94V0 PCB Board with RoHS for Power Bank
94V0 PCB Board with RoHS for Power Bank
94V0 PCB Board with RoHS for Power Bank

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