| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | Aluminum |
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Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic flow production line, auto panel plating line, auto P.T.H Line, and other precision production equipments and AOI testing machine, flying probe tester machine and other advanced detection equipments.
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Rigid PCB Capability |
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Item |
Standard |
Advance |
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Layers |
1-20 layers |
22-64 layers |
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HDI |
1+N+1&2+N+2&3+N+3 |
Any layer interconnection |
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Finger(Au) |
1-30U" |
30-50U" |
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Max Panel Size |
520*800mm |
800*1200mm |
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Min Panel Size |
5*5mm |
5*5mm |
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Board Thickness |
0.1mm-4.0mm |
4.0mm-7.0mm |
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Min Half Hole/Slot |
0.5mm |
0.3mm |
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Min. Line Width/Space |
3mil/3mil |
2mil/2mil |
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Min. Hole Size |
0.1mm |
0.075mm |
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Inner Copper Thickness |
0.5-4oz |
0.5-10oz |
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Outer Copper Thickness |
0.5-6oz |
0.5-15oz or more |
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Line Width |
±10% |
±5% |
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PTH Hole Size |
±0.075mm |
±0.05mm |
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NPTH Hole Size |
± 0.05mm |
±0.025mm |
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Hole Position |
±0.05mm |
±0.025mm |
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Outline |
±0.1mm |
±0.05mm |
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BoardThickness |
±10% |
±5% |
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Impedance Control |
±10% |
±5% |
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Bow and Twist |
0.75% |
0.50% |
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Board Material |
FR-4, CEM-3, Rogers, High TG,High Speed,High Frequency ,High Thermal Conductivity |
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Surface Finish |
HASL(with Pb free), Plated Ni/Au, ENIG, Immersion Tin, Immersion Ag, OSP,etc. |
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Solder Mask |
White, Black, Blue, Green, Grey, Red,Yellow, Transparent |
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Legend Color |
White, Black, Yellow etc. |
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Certification |
UL, IATF16949, ISO, RoHs&Reach |
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| PCB Assembly Capability | ||||
| Item | Lot Size | |||
| Normal | Special | |||
| PCB(used for SMT)specification | (L*W) | Min | L≥3mm | L<2mm |
| W≥3mm | ||||
| Max | L≤800mm | L > 1200mm | ||
| W≤460mm | W> 500mm | |||
| (T) | Min thickness | 0.2mm | T<0.1mm | |
| Max thickness | 4mm | T>4.5mm | ||
| SMT components specification | outline dimension | Min size | 0201 | 01005 |
| (0.6mm*0.3mm) | (0.3mm*0.2mm) | |||
| Max size | 60mm*48mm | 200mm*125mm<SMD | ||
| component thickness | T≤15mm | 6.5mm<T≤15mm | ||
| QFP,SOP,SOJ (multi pins) |
Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm | |
| CSP,BGA | Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm | |
| DIP PCB SPEC | (L*W) | Min Size | L≥50mm | L<50mm |
| W≥30mm | ||||
| Max Size | L≤1200mm | L≥1200mm | ||
| W≤450mm | W≥500mm | |||
| (T) | Minimum Thickness | 0.8mm | T<0.8mm | |
| Maximum Thickness | 3.5mm | T>2mm | ||
| BOX BUILD | FIRMWARE | Provide programming firmware files,Firmware + software installation instructions | ||
| Function test | Level of testing required along with test instructions | |||
| Plastic & Metal Casings | Metal Casting,Sheet Metal work, Metal Fabrication, Metal and plastic extrusion | |||
| BOX BUILD | 3D CAD model of enclosure + specifications (include drawings, size, weight, colour, material, finish, IP rating, etc) |
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| PCBA FILES | PCB FILE | PCB Altium/Gerber/Eagle files | ||
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