Customization: | Available |
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Structure: | Multilayer Rigid PCB |
Dielectric: | FR-4 |
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Rigid PCB Capability | |||
Item | Standard | Advance | |
Layers | 1-20 layers | 22-64 layers |
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HDI | 1+N+1&2+N+2&3+N+3 | Any layer interconnection |
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Finger(Au) | 1-30U" | 30-50U" | |
Max Panel Size | 520*800mm | 800*1200mm | |
Min Panel Size | 5*5mm | 5*5mm | |
Board Thickness | 0.1mm-4.0mm | 4.0mm-7.0mm | |
Min Half Hole/Slot | 0.5mm | 0.3mm | |
Min. Line Width/Space | 3mil/3mil | 2mil/2mil | |
Min. Hole Size | 0.1mm | 0.075mm | |
Inner Copper Thickness | 0.5-4oz | 0.5-10oz |
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Outer Copper Thickness | 0.5-6oz | 0.5-15oz or more |
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Tolerance | Line Width | ±10% | ±5% |
PTH Hole Size | ±0.075mm | ±0.05mm | |
NPTH Hole Size | ± 0.05mm | ±0.025mm | |
Hole Position |
±0.05mm |
±0.025mm |
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Outline | ±0.1mm | ±0.05mm |
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Board Thickness | ±10% | ±5% | |
Impedance Control | ±10% | ±5% |
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Bow and Twist | 0.75% | 0.50% | |
Board Material | FR-4, CEM-3, Rogers, High TG,High Speed,High Frequency ,High Thermal Conductivity |
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Surface Finish | HAL(with Pb free), Plated Ni/Au, ENIG, Immersion Tin, Immersion Ag, OSP,etc. |
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Solder Mask | White, Black, Blue, Green, Grey, Red,Yellow, Transparent | ||
Legend Color | White, Black, Yellow etc. |
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Certification | UL, IATF16949, ISO, RoHs&Reach |
PCB Assembly Capability | ||||
Item | Lot Size | |||
Normal | Special | |||
PCB(used for SMT)spec | (L*W) | Min | L≥3mm | L<2mm |
W≥3mm | ||||
Max | L≤1200mm | L > 1200mm | ||
W≤500mm | W> 500mm | |||
(T) | Min thickness | 0.2mm | T<0.1mm | |
Max thickness | 4.5mm | T>4.5mm | ||
SMT components spec | outline dimension | Min size | 201 | 1005 |
(0.6mm*0.3mm) | (0.3mm*0.2mm) | |||
Max size | 200mm*125mm | 200mm*125mm<SMD | ||
component thickness | T≤6.5mm | 6.5mm<T≤15mm | ||
QFP,SOP,SOJ (multi pins) |
Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm | |
CSP,BGA | Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm | |
DIP PCB SPEC | (L*W) | Min Size | L≥50mm | L<50mm |
W≥30mm | ||||
Max Size | L≤1200mm | L≥1200mm | ||
W≤500mm | W≥500mm | |||
(T) | Minimum Thickness | 0.8mm | T<0.8mm | |
Maximum Thickness | 2mm | T>2mm | ||
BOX BULID | FIRMWARE | Provide programming firmware files,Firmware + software installation instructions | ||
Function test | Level of testing required along with test instructions | |||
Plastic & Metal Casings | Metal Casting,Sheet Metal work, Metal Fabrication, Metal and plastic extrusion | |||
BOX BUILD | 3D CAD model of enclosure + specifications (include drawings, size, weight, colour, material, finish, IP rating, etc) |
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PCBA FILES | PCB FILE | PCB Altium/Gerber/Eagle files (Including specs such as thickness, copper thickness, solder mask colour, finish, etc) |