Shenzhen Electronic PCB PCBA Manufacturing 94V0 RoHS PCB Board Assembly Geber Files Design Service Clone Prototype PCB PCBA

• Type: Rigid Circuit Board
• Dielectric: FR-4
• Material: Fiberglass Epoxy
• Application: Consumer Electronics
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Model NO.: UC-11121124
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Organic Resin
• Brand: UC
• Board Layer: 1-24 Layer
• Base Material Type: Fr4
• Surface Treatment: Immersion Gold/HASL Lead Free/OPS/ Immersion Silve
• Material Finished Thickness: 1.6mm
• Solder Mask Color: Green/White/Black/Blue/Red
• Lead Time: 7 Working Days
• Certificate: UL(Us&Canada). ISO9001. RoHS, Ts, SGS
• Transport Package: Vacuum Package
• Specification: IPC class II
• Trademark: UC
• Origin: Shenzhen, China
• HS Code: 8534009000
• Production Capacity: 20000 Sqm/Month

Product Description

Top Quality Enig 12L PCB Board for Medical Electronics

 

Product Description

Layer:12 layer
Finished Board thickness:1.6MM
Board material:FR-4
Brand:KB
Tg aility:140 
Finished Copper thickness:1 oz
Surface treatment: Enig
solder mask Colour:Green
Min hole size:0.3mm

 


We provide professional PCB manufacturing service. 
It will be our great pleasure to discuss with you about your PCB needs and requirements.
Customer Satisfaction is Always Our First Priority!

1.Products Application






 

2. Market Distribution
 

 
 
3.Technical Capabilities

Items		Speci.	Remark
Max panel size		32" x 20.5"(800mm x 520mm)
Min trace width/ space (inner layer)		4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)		5 mil(0.13mm)	hole ring width
Min thickness(inner layer)		4 mil(0.1mm)	without copper
Inner copper thickness		1~4 oz
Outer copper thickness		0.5~6 oz
Finished board thickness		0.4-3.2 mm
Board thickness tolerance control	±0.10 mm	±0.10 mm	1~4 L
	±10%	±10%	6~8 L
	±10%	±10%	≥10 L
Inner layer treatment		brown oxidation
Layer count Capability		1-30 LAYER
alignment between ML		±2mil
Min drilling		0.15 mm
Min finished hole		0.1 mm
Hole precision		±2 mil(±50 um)
tolerance for Slot		±3 mil(±75 um)
tolerance for PTH		±3 mil(±75um)
tolerance for NPTH		±2mil(±50um)
Max Aspect Ratio for PTH		8:1
Hole wall copper thickness		15-50um
Alignment of outer layers		4mil/4mil
Min trace width/space for outer layer		4mil/4mil
Tolerance of Etching		+/-10%
Thickness of solder mask	on trace	0.4-1.2mil(10-30um)
	at trace corner	≥0.2mil(5um)
	On base material	≤+1.2mil   Finished thickness
Hardness of solder mask		6H
Alignment of solder mask film		±2mil(+/-50um)
Min width of solder mask bridge		4mil(100um)
Max hole with solder plug		0.5mm
Surface finish		HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger		280u"(7um)
Max gold thickness for Gold finger		30u"(0.75um)
Nickel thickness in Immersion Gold		120u"/240u"(3um/6um)
Gold thickness in Immersion Gold		2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance		50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength		≥61B/in(≥107g/mm)
bow and twist		0.75%

 
4.Products Equipment


5. Our Certifications