Customization: | Available |
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Structure: | Double-Sided Rigid PCB |
Dielectric: | FR-4 |
Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
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Payment Methods: |
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Refund policy: | Claim a refund if your order doesn't ship, is missing, or arrives with product issues. |
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Rigid PCB Capability |
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Item |
Standard |
Advance |
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Layers |
1-20 layers |
22-64 layers |
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HDI |
1+N+1&2+N+2&3+N+3 |
Any layer interconnection |
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Finger(Au) |
1-30U" |
30-50U" |
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Max Panel Size |
520*800mm |
800*1200mm |
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Min Panel Size |
5*5mm |
5*5mm |
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Board Thickness |
0.1mm-4.0mm |
4.0mm-7.0mm |
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Min Half Hole/Slot |
0.5mm |
0.3mm |
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Min. Line Width/Space |
3mil/3mil |
2mil/2mil |
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Min. Hole Size |
0.1mm |
0.075mm |
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Inner Copper Thickness |
0.5-4oz |
0.5-10oz |
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Outer Copper Thickness |
0.5-6oz |
0.5-15oz or more |
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Tolerance |
Line Width |
±10% |
±5% |
PTH Hole Size |
±0.075mm |
±0.05mm |
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NPTH Hole Size |
± 0.05mm |
±0.025mm |
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Hole Position |
±0.05mm |
±0.025mm |
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Outline |
±0.1mm |
±0.05mm |
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Board Thickness |
±10% |
±5% |
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Impedance Control |
±10% |
±5% |
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Bow and Twist |
0.75% |
0.50% |
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Board Material |
FR-4, CEM-3, Rogers, High TG,High Speed,High Frequency ,High Thermal Conductivity |
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Surface Finish |
HASL(with Pb free), Plated Ni/Au, ENIG, Immersion Tin, Immersion Ag, OSP,etc. |
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Solder Mask |
White, Black, Blue, Green, Grey, Red,Yellow, Transparent |
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Legend Color |
White, Black, Yellow etc. |
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Certification |
UL, IATF16949, ISO, RoHs&Reach |
PCB Assembly Capability | ||||
Item | Lot Size | |||
Normal | Special | |||
PCB(used for SMT)specification | (L*W) | Min | L≥3mm | L<2mm |
W≥3mm | ||||
Max | L≤800mm | L > 1200mm | ||
W≤460mm | W> 500mm | |||
(T) | Min thickness | 0.2mm | T<0.1mm | |
Max thickness | 4mm | T>4.5mm | ||
SMT components specification | outline dimension | Min size | 0201 | 01005 |
(0.6mm*0.3mm) | (0.3mm*0.2mm) | |||
Max size | 60mm*48mm | 200mm*125mm<SMD | ||
component thickness | T≤15mm | 6.5mm<T≤15mm | ||
QFP,SOP,SOJ (multi pins) |
Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm | |
CSP,BGA | Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm | |
DIP PCB SPEC | (L*W) | Min Size | L≥50mm | L<50mm |
W≥30mm | ||||
Max Size | L≤1200mm | L≥1200mm | ||
W≤450mm | W≥500mm | |||
(T) | Minimum Thickness | 0.8mm | T<0.8mm | |
Maximum Thickness | 3.5mm | T>2mm | ||
BOX BUILD | FIRMWARE | Provide programming firmware files,Firmware + software installation instructions | ||
Function test | Level of testing required along with test instructions | |||
Plastic & Metal Casings | Metal Casting,Sheet Metal work, Metal Fabrication, Metal and plastic extrusion | |||
BOX BUILD | 3D CAD model of enclosure + specifications (include drawings, size, weight, colour, material, finish, IP rating, etc) |
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PCBA FILES | PCB FILE | PCB Altium/Gerber/Eagle files (Including specs such as thickness, copper thickness, solder mask colour, finish, etc) |