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• Type: Rigid Circuit Board
• Flame Retardant Properties: V0
• Dielectric: Ali
• Base Material: Aluminum
• Insulation Materials: Organic Resin
• Processing Technology: Electrolytic Foil
• Model NO.: UC-11091053
• Application: Consumer Electronics
• Mechanical Rigid: Rigid
• Material: Aluminum
• Brand: UC
• Board Material: Aluminium Base
• Soldermask Color: White
• Size: 1.2m
• Transport Package: Vacuum Package
• Specification: UL, RoHs, SGS, ISO, TS
• Trademark: UC
• Origin: Shenzhen, China
• HS Code: 8534009000
• Production Capacity: 20000sqm/Month

Product Description

Parameters:
Layers: 1
Thicknes: 1.6±0.12mm
Min. Hole Size: 0.5mm
Surface Treatment: OSP
 
Applications
LED, LIGHT.                      

     Our main products range from Multilayer PCB,High frequency PCB, Metal base PCB, Hi-Tg heavy copper foil PCB and Mixed Dielectric base PCB, HDI, rigid-flex PCB,and many other customized PCB with special performance which are widely used in Communication, power supply, computer, consumer electronics, industrial control, medical device, Aeronautics and Astronautics high technology field and spread over  America, Europe and some Asia Districts, achieving their satisfication.
      Ucreate has been certificated with ISO9001, ISO14001, UL from US and Canada, all of our products are with ROHS certification.
                    
 
Technical Capabilities:

Items		Speci.	Remark
Max panel size		32" x 20.5"(800mm x 520mm)
Min trace width/ space (inner layer)		4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)		5 mil(0.13mm)	hole ring width
Min thickness(inner layer)		4 mil(0.1mm)	without copper
Inner copper thickness		1~4 oz
Outer copper thickness		0.5~6 oz
Finished board thickness		0.4-3.2 mm
Board thickness tolerance control	±0.10 mm	±0.10 mm	1~4 L
	±10%	±10%	6~8 L
	±10%	±10%	≥10 L
Inner layer treatment		brown oxidation
Layer count Capability		1-30 LAYER
alignment between ML		±2mil
Min drilling		0.15 mm
Min finished hole		0.1 mm
Hole precision		±2 mil(±50 um)
tolerance for Slot		±3 mil(±75 um)
tolerance for PTH		±3 mil(±75um)
tolerance for NPTH		±2mil(±50um)
Max Aspect Ratio for PTH		8:1
Hole wall copper thickness		15-50um
Alignment of outer layers		4mil/4mil
Min trace width/space for outer layer		4mil/4mil
Tolerance of Etching		+/-10%
Thickness of solder mask	on trace	0.4-1.2mil(10-30um)
	at trace corner	≥0.2mil(5um)
	On base material	≤+1.2mil   Finished thickness
Hardness of solder mask		6H
Alignment of solder mask film		±2mil(+/-50um)
Min width of solder mask bridge		4mil(100um)
Max hole with solder plug		0.5mm
Surface finish		HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger		280u"(7um)
Max gold thickness for Gold finger		30u"(0.75um)
Nickel thickness in Immersion Gold		120u"/240u"(3um/6um)
Gold thickness in Immersion Gold		2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance		50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength		≥61B/in(≥107g/mm)
bow and twist		0.75%

 


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