94V0 RoHS PCB Board and Circuit Diagram Flex Board Maker
Product Details
| Customization: | Available |
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| Structure: | Single-Sided FPC |
| Material: | Polyimide |
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Address
Room 315,Building C,Yunhai Enterprise Headquater Base,No.42 Caiyun Road,Jixiang ...
International Commercial Terms(Incoterms)
FOB, CIF, DAT, DDP, DAP, EXW
Terms of Payment
LC, T/T, D/P, PayPal, Western Union
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Basic Info.
- Model NO.
- UC081607
- Combination Mode
- Adhesive Flexible Plate
- Application
- Digital Products, Computer with LCD Screen
- Conductive Adhesive
- Conductive Silver Paste
- Flame Retardant Properties
- V0
- Processing Technology
- Electrolytic Foil
- Base Material
- Copper
- Insulation Materials
- Organic Resin
- Brand
- Ucreate
- Board Layer
- 1
- Board Thickness
- 0.15-0.2mm
- Surface Treatment
- Enig
- Size
- 500*8mm
- Finished Copper Thickness
- 35um
- Lead Time
- 7 Working Days
- PCB Testing
- Flying Probe Testing/E-Testing
- Fast Turn
- 3 Working Days
- Ipc Standards
- Ipc-Class 2
- Base Material Type
- Pi
- Transport Package
- Vacuum
- Specification
- UL(US&Canada). ISO. RoHs, TS, SGS
- Trademark
- UC
- Origin
- China
- HS Code
- 8534009000
- Production Capacity
- 20000 Sqm/Month
Packaging & Delivery
- Package Size
- 80.00cm * 80.00cm * 80.00cm
- Package Gross Weight
- 2.000kg
Product Description
Ucreate LTD PCB's Aim
Customer Satisfaction is Always Our First Priority!
*Quality Policy
*Top Quality and high efficiency
*Improve continuously
*Achieve customer's satisfaction
1.Products Application
2. Market Distribution
3.Technical Capabilities
| Items | Speci. | Remark | |
| Max panel size | 32" x 20.5"(800mm x 520mm) | ||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
| Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width | |
| Min thickness(inner layer) | 4 mil(0.1mm) | without copper | |
| Inner copper thickness | 1~4 oz | ||
| Outer copper thickness | 0.5~6 oz | ||
| Finished board thickness | 0.4-3.2 mm | ||
Board thickness tolerance control |
±0.10 mm | ±0.10 mm | 1~4 L |
| ±10% | ±10% | 6~8 L | |
| ±10% | ±10% | ≥10 L | |
| Inner layer treatment | brown oxidation | ||
| Layer count Capability | 1-30 LAYER | ||
| alignment between ML | ±2mil | ||
| Min drilling | 0.15 mm | ||
| Min finished hole | 0.1 mm | ||
| Hole precision | ±2 mil(±50 um) | ||
| tolerance for Slot | ±3 mil(±75 um) | ||
| tolerance for PTH | ±3 mil(±75um) | ||
| tolerance for NPTH | ±2mil(±50um) | ||
| Max Aspect Ratio for PTH | 8:1 | ||
| Hole wall copper thickness | 15-50um | ||
| Alignment of outer layers | 4mil/4mil | ||
| Min trace width/space for outer layer | 4mil/4mil | ||
| Tolerance of Etching | +/-10% | ||
| Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) | |
| at trace corner | ≥0.2mil(5um) | ||
| On base material | ≤+1.2mil Finished thickness |
||
| Hardness of solder mask | 6H | ||
| Alignment of solder mask film | ±2mil(+/-50um) | ||
| Min width of solder mask bridge | 4mil(100um) | ||
| Max hole with solder plug | 0.5mm | ||
| Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | ||
| Max Nickel thickness for Gold finger | 280u"(7um) | ||
| Max gold thickness for Gold finger | 30u"(0.75um) | ||
| Nickel thickness in Immersion Gold | 120u"/240u"(3um/6um) | ||
| Gold thickness in Immersion Gold | 2u"/6u"(0.05um/0.15um) | ||
| Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||
| Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||
| bow and twist |
0.75% | ||
4.Production Process
5.Products Equipment
6.Packaging and Transport
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