94V0 RoHS PCB Board and Circuit Diagram Flex Board Maker
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Product Attributes
- Customization
- Available
- Structure
- Single-Sided FPC
- Material
- Polyimide
- Model NO.
- UC081607
- Combination Mode
- Adhesive Flexible Plate
- Application
- Digital Products, Computer with LCD Screen
- Conductive Adhesive
- Conductive Silver Paste
- Flame Retardant Properties
- V0
- Processing Technology
- Electrolytic Foil
- Base Material
- Copper
- Insulation Materials
- Organic Resin
- Brand
- Ucreate
- Board Layer
- 1
- Board Thickness
- 0.15-0.2mm
- Surface Treatment
- Enig
- Size
- 500*8mm
- Finished Copper Thickness
- 35um
- Lead Time
- 7 Working Days
- PCB Testing
- Flying Probe Testing/E-Testing
- Fast Turn
- 3 Working Days
- Ipc Standards
- Ipc-Class 2
- Base Material Type
- Pi
- Transport Package
- Vacuum
- Specification
- UL(US&Canada). ISO. RoHs, TS, SGS
- Trademark
- UC
- Origin
- China
- HS Code
- 8534009000
- Production Capacity
- 20000 Sqm/Month
- Package Size
- 80.00cm * 80.00cm * 80.00cm
- Package Gross Weight
- 2.000kg
Shipping
- Shipping Cost:
- Contact the supplier about freight and estimated delivery time.
Online Trading Protection
- Payment Guarantee
-
Platform-protected payments with refund support for eligible order issues.
- Platform Logistics
- Clearer shipment tracking with platform-supported logistics.
- Inspection Service
- Optional pre-shipment inspection for quality and quantity checks.
- After-Sales & Dispute Handling
- Platform-assisted dispute resolution, including refunds or returns when applicable.
Only orders placed and paid through Made-in-China.com Secured Trading are eligible for payment protection and the corresponding platform services.
Product Images of 94V0 RoHS PCB Board and Circuit Diagram Flex Board Maker
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Product Description
Ucreate LTD PCB's Aim
Customer Satisfaction is Always Our First Priority!
*Quality Policy
*Top Quality and high efficiency
*Improve continuously
*Achieve customer's satisfaction
1.Products Application
2. Market Distribution
3.Technical Capabilities
| Items | Speci. | Remark | |
| Max panel size | 32" x 20.5"(800mm x 520mm) | ||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
| Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width | |
| Min thickness(inner layer) | 4 mil(0.1mm) | without copper | |
| Inner copper thickness | 1~4 oz | ||
| Outer copper thickness | 0.5~6 oz | ||
| Finished board thickness | 0.4-3.2 mm | ||
Board thickness tolerance control |
±0.10 mm | ±0.10 mm | 1~4 L |
| ±10% | ±10% | 6~8 L | |
| ±10% | ±10% | ≥10 L | |
| Inner layer treatment | brown oxidation | ||
| Layer count Capability | 1-30 LAYER | ||
| alignment between ML | ±2mil | ||
| Min drilling | 0.15 mm | ||
| Min finished hole | 0.1 mm | ||
| Hole precision | ±2 mil(±50 um) | ||
| tolerance for Slot | ±3 mil(±75 um) | ||
| tolerance for PTH | ±3 mil(±75um) | ||
| tolerance for NPTH | ±2mil(±50um) | ||
| Max Aspect Ratio for PTH | 8:1 | ||
| Hole wall copper thickness | 15-50um | ||
| Alignment of outer layers | 4mil/4mil | ||
| Min trace width/space for outer layer | 4mil/4mil | ||
| Tolerance of Etching | +/-10% | ||
| Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) | |
| at trace corner | ≥0.2mil(5um) | ||
| On base material | ≤+1.2mil Finished thickness |
||
| Hardness of solder mask | 6H | ||
| Alignment of solder mask film | ±2mil(+/-50um) | ||
| Min width of solder mask bridge | 4mil(100um) | ||
| Max hole with solder plug | 0.5mm | ||
| Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | ||
| Max Nickel thickness for Gold finger | 280u"(7um) | ||
| Max gold thickness for Gold finger | 30u"(0.75um) | ||
| Nickel thickness in Immersion Gold | 120u"/240u"(3um/6um) | ||
| Gold thickness in Immersion Gold | 2u"/6u"(0.05um/0.15um) | ||
| Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||
| Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||
| bow and twist |
0.75% | ||
4.Production Process
5.Products Equipment
6.Packaging and Transport
About the Supplier
This supplier has been audited by BV. Verify the report on the official BV website with ID "MIC-ASR222544". Items marked "" are certified.
Company Profile
Established in 2004, Ucreate PCB Co., Ltd is a professional manufacturing enterprise majoring in high end and multi-layer Printed Circuit Board.
Along with more than 10 years' development, Ucreate has settled its factories both in Shenzhen and Huizhou city, covering facility area 12000 Square meters, with more than 800 employees, among them, 150 with highly professional who are no less than 10 years expert in PCB field. Now we are reaching a monthly capability of 30000 Square meters.
Our main products range from Multilayer PCB, High frequency PCB, Metal base PCB, Hi-Tg heavy copper foil PCB and Mixed Dielectric base PCB, HDI, rigid-flex PCB, and many other customized PCB with special performance which are widely used in Communication, power supply, computer, consumer electronics, industrial control, medical device, Aeronautics and Astronautics high technology field and spread over America, Europe and some Asia Districts, achieving their satisfication.
Ucreate has been certificated with ISO9001, ISO14001, UL from US and Canada, all of our products are with RoHS certification.
Under the mission " high quality, exact delivery, customers' satisfactions, continuous development, Common innovation ", We believe Ucreate will develop better and better with your participation.
About Our Factory & Business Background
- Address
- Room 315,Building C,Yunhai Enterprise Headquater Base,No.42 Caiyun Road,Jixiang Community,Longcheng Street,Longgang District,Shenzhen,China
- Terms of Payment
- LC, T/T, D/P, PayPal, Western Union
- International Commercial Terms(Incoterms)
- FOB, CIF, DAT, DDP, DAP, EXW
- Average Lead Time
- Peak Season Lead Time, within 15 workdays, Off Season Lead Time, within 15 workdays
- Nearest Port
- Yantian
Our Production Capability & Technical Expertise
Our Industry Experience & Global Business Record
- Export Year
- 2008-03-29
- Main Markets
- North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
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