3 Layer FPC Board with High Quality in Medical Device

Product Details
Customization: Available
Structure: Double-Sided FPC
Material: Polyimide
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  • 3 Layer FPC Board with High Quality in Medical Device
  • 3 Layer FPC Board with High Quality in Medical Device
  • 3 Layer FPC Board with High Quality in Medical Device
  • 3 Layer FPC Board with High Quality in Medical Device
  • 3 Layer FPC Board with High Quality in Medical Device
  • 3 Layer FPC Board with High Quality in Medical Device
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Basic Info.

Model NO.
UC-3571
Combination Mode
Adhesive Flexible Plate
Application
Medical Device
Conductive Adhesive
Conductive Silver Paste
Flame Retardant Properties
V0
Processing Technology
Electrolytic Foil
Base Material
Pi
Insulation Materials
Epoxy Resin
Brand
Uc
Board Layer
3
Board Thickness
0.3mm
Soldermask
Black
Surface Finish
Enig
Lead Time
9 Working Days
Ipc Standards
Ipc Class II
Transport Package
Vacuum Pacakge
Specification
UL(US&Canada). ISO9001. RoHs, TS, SGS
Trademark
UC
Origin
Shenzhen, China
HS Code
8534009000
Production Capacity
20000sqm/Month

Packaging & Delivery

Package Size
50.00cm * 50.00cm * 50.00cm
Package Gross Weight
2.000kg

Product Description

3 Layer FPC Board with High Quality in Medical Device
Technical Capabilities
Items Speci. Remark
Max panel size 32" x 20.5"(800mm x 520mm)  
Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm)  
Min PAD (inner layer) 5 mil(0.13mm) hole ring width
Min thickness(inner layer) 4 mil(0.1mm) without copper
Inner copper thickness 1~4 oz  
Outer copper thickness 0.5~6 oz  
Finished board thickness 0.4-3.2 mm  

Board thickness tolerance control
±0.10 mm ±0.10 mm 1~4 L
±10% ±10% 6~8 L
±10% ±10% ≥10 L
Inner layer treatment brown oxidation  
Layer count Capability 1-30 LAYER  
alignment between ML ±2mil  
Min drilling 0.15 mm  
Min finished hole 0.1 mm  
Hole precision ±2 mil(±50 um)  
tolerance for Slot ±3 mil(±75 um)  
tolerance for PTH ±3 mil(±75um)  
tolerance for NPTH ±2mil(±50um)  
Max Aspect Ratio for PTH 8:1  
Hole wall copper thickness 15-50um  
Alignment of outer layers 4mil/4mil  
Min trace width/space for outer layer 4mil/4mil  
Tolerance of Etching +/-10%  
Thickness of solder mask on trace 0.4-1.2mil(10-30um)  
at trace corner ≥0.2mil(5um)  
On base material ≤+1.2mil
  Finished thickness
 
Hardness of solder mask 6H  
Alignment of solder mask film ±2mil(+/-50um)  
Min width of solder mask bridge 4mil(100um)  
Max hole with solder plug 0.5mm  
Surface finish HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.  
Max Nickel thickness for Gold finger 280u"(7um)  
Max gold thickness for Gold finger 30u"(0.75um)  
Nickel thickness in Immersion Gold 120u"/240u"(3um/6um)  
Gold thickness in Immersion Gold 2u"/6u"(0.05um/0.15um)  
Impedance control and its tolerance 50±10%,75±10%,100±10% 110±10%  
Trace Anti-stripped strength ≥61B/in(≥107g/mm)  
bow and twist 0.75%  

Our Equipments
3 Layer FPC Board with High Quality in Medical Device
3 Layer FPC Board with High Quality in Medical Device
3 Layer FPC Board with High Quality in Medical Device

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3 Layer FPC Board with High Quality in Medical Device

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3 Layer FPC Board with High Quality in Medical Device

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