Customization: | Available |
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Structure: | Double-Sided FPC |
Material: | Polyimide |
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Items | Speci. | Remark | |
Max panel size | 32" x 20.5"(800mm x 520mm) | ||
Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width | |
Min thickness(inner layer) | 4 mil(0.1mm) | without copper | |
Inner copper thickness | 1~4 oz | ||
Outer copper thickness | 0.5~6 oz | ||
Finished board thickness | 0.4-3.2 mm | ||
Board thickness tolerance control |
±0.10 mm | ±0.10 mm | 1~4 L |
±10% | ±10% | 6~8 L | |
±10% | ±10% | ≥10 L | |
Inner layer treatment | brown oxidation | ||
Layer count Capability | 1-30 LAYER | ||
alignment between ML | ±2mil | ||
Min drilling | 0.15 mm | ||
Min finished hole | 0.1 mm | ||
Hole precision | ±2 mil(±50 um) | ||
tolerance for Slot | ±3 mil(±75 um) | ||
tolerance for PTH | ±3 mil(±75um) | ||
tolerance for NPTH | ±2mil(±50um) | ||
Max Aspect Ratio for PTH | 8:1 | ||
Hole wall copper thickness | 15-50um | ||
Alignment of outer layers | 4mil/4mil | ||
Min trace width/space for outer layer | 4mil/4mil | ||
Tolerance of Etching | +/-10% | ||
Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) | |
at trace corner | ≥0.2mil(5um) | ||
On base material | ≤+1.2mil Finished thickness |
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Hardness of solder mask | 6H | ||
Alignment of solder mask film | ±2mil(+/-50um) | ||
Min width of solder mask bridge | 4mil(100um) | ||
Max hole with solder plug | 0.5mm | ||
Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | ||
Max Nickel thickness for Gold finger | 280u"(7um) | ||
Max gold thickness for Gold finger | 30u"(0.75um) | ||
Nickel thickness in Immersion Gold | 120u"/240u"(3um/6um) | ||
Gold thickness in Immersion Gold | 2u"/6u"(0.05um/0.15um) | ||
Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||
Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||
bow and twist |
0.75% |