*Base material: FR-4 CEM-1
*Solder mask: Green, black, red, yellow, white
*Min. Line width: 0.075mm
*Min. Line space: 0.075mm
*Min. Hole diameter: 0.1mm
*Surface treatment: Immersion gold, OSP. Lead free HASL.
*Blind/buried via holes: OK
*lead time: Seven to ten days (HDI: About 30 days)
We can also make quick pcb. As customers plates copied from the PCB, PCB design, prototype production, production, processing, and other SMT one-stop service.
Single-double sides pcb delivery time: 12-24 hours
4 layer- 8 layer pcb delivery time: 48-96 hours
|Files||Gerber, Protel, Powerpcb, Autocad, Cam350, etc|
|Material||FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic)|
|Layer No.||1 - 30 Layers|
|Board thickness||0.0075"(0.2mm)-0.125"(3.2mm) |
|Board Thickness Tolerance||±10%|
|Copper thickness||0.5OZ - 4OZ|
|Min Trace Width (a)||0.005"(0.125mm)|
|Min Space Width (b)||0.005"(0.125mm)|
|Min Annular Ring||0.005"(0.125mm)|
|SMD Pitch (a)||0.012"(0.3mm)|
|pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)||0.027"(0.675mm)|
|Min Solder Mask Dam (a)||0.005"(0.125mm)|
|Soldermask Clearance (b)||0.005"(0.125mm)|
|Min SMT Pad spacing (c)||0.004"(0.1mm)|
|Solder Mask Thickness||0.0007"(0.018mm)|
|Hole size||0.01"(0.25mm)-- 0.257"(6.5mm)|
|Hole Size Tol (+/-)||±0.003"(±0.0762mm)|
|Lead free HASL||2.5um|
|Immersion Gold||Nickel 3-7um Au:1-3u''|
|Panel Outline Tol (+/-)||±0.004''(±0.1mm)|
|V-cut||15° 30° 45° 60°|
|Surface finish||HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,|
|Certificate ||ROHS ISO9001:2000 TS16949 SGS UL|
|Special requirements||Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger|
We specilized in :
Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic flow production line, auto panel plating line, auto P.T.H Line, and other precision production equipments and AOI testing machine, flying probe tester machine and other advanced detection equipments.
Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping
PCB assembly Equipment:
1. High speed and precision chip placer or multi-function SMD mounter
2. Wave soldering machine
3. Vacuum machine
4. High temperature box
5. Auto-solder paste printer
6. Hot- and mixed-air reflow
1. Components list
(a) Specification, brand, footprint
(b)To short the lead time, please kindly advise us if there is any acceptable components substitution.
(c) Schematic if necessary
2. PCB board information
(a) Gerber files
(b) PCB board processing technic
3. Testing Guide & Test Fixtures if necessary
4. Programming files & Programming tool if necessary
5. Package requirement
Why Choose Us?
1. Your inquiry related to our products or prices will be replied in 24hrs.
2. Well-trained and experienced staffs to answer all your enquires in fluent English
3. OEM&ODM, we can help you to design and put into product.
4. Distributorship are offered for your unique design and some our current models
5. Protection of your sales area, ideas of design and all your private information
1. Payment: T/T in advance (Western Union , payple is welcomed)
2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.
3. Sample can be delivered in 3days
4. Shipping freight are quoted under your requests
5. Shipping port: Shen zhen,Mainland China
6. Discounts are offered based on order quantities
7. MOQ: 1PCS
Package &Shipping Methods:
1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement