Ucreate Power Bank PCB Circuit Boards and PCBA Manufacturer Supplier

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: UC-092203
• Material: Fiberglass Epoxy
• Application: Aerospace
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Immersional Gold
• Base Material: Copper
• Insulation Materials: Organic Resin
• Brand: Ucreate PCB
• Board Thickness: 1.2~2.0mm
• Surface Finihsing: Immersional Gold
• Lead Time: 6-8 Working Days
• Certificate: ISO,UL,RoHS
• PCB Testing: E-Testing; Flying Probe Testing
• Mask Ink Color: White/Black/Green/Red/Yellow/Blue
• Color: Green Blue Red
• Number of Layers: Multilayer
• Copper Thickness: 2oz
• Condition: Original Made
• Transport Package: Vacuum Packing
• Specification: IPC-Class 2
• Trademark: Ucreate PCB
• Origin: Shenzhen China
• HS Code: 85340090
• Production Capacity: 5000sq. M/Month
• Package Size: 80.00cm * 80.00cm * 80.00cm
• Package Gross Weight: 2.000kg

Product Description

Product Description:
*Layers: 1-22
*Base material: FR-4 CEM-1
*Thickness: 0.2-5.0mm
*Solder mask: Green, black, red, yellow, white
*Min. Line width: 0.075mm
*Min. Line space: 0.075mm
*Min. Hole diameter: 0.1mm
*Surface treatment: Immersion gold, OSP. Lead free HASL.
*Blind/buried via holes: OK
*lead time: Seven to ten days (HDI: About 30 days)

We can also make quick pcb. As customers plates copied from the PCB, PCB design, prototype production, production, processing, and other SMT one-stop service.
Single-double sides pcb delivery time: 12-24 hours
4 layer- 8 layer pcb delivery time: 48-96 hours
 

Files	Gerber, Protel, Powerpcb, Autocad, Cam350, etc
Material	FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Taconic)
Layer No.	1 - 30 Layers
Board thickness	0.0075"(0.2mm)-0.125"(3.2mm)
Board Thickness Tolerance	±10%
Copper thickness	0.5OZ - 4OZ
Impedance Control	±10%
Warpage	0.075%-1.5%
Peelable	0.012"(0.3mm)-0.02'(0.5mm)
Min Trace Width (a)	0.005"(0.125mm)
Min Space Width (b)	0.005"(0.125mm)
Min Annular Ring	0.005"(0.125mm)
SMD Pitch (a)	0.012"(0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)	0.027"(0.675mm)
Regesiter torlerance	0.05mm
Min Solder Mask Dam (a)	0.005"(0.125mm)
Soldermask Clearance (b)	0.005"(0.125mm)
Min SMT Pad spacing (c)	0.004"(0.1mm)
Solder Mask Thickness	0.0007"(0.018mm)
Hole size	0.01"(0.25mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)	±0.003"(±0.0762mm)
Aspect Ratio	6:01
Hole Registration	0.004"(0.1mm)
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel  3-7um  Au:1-3u''
OSP	0.2-0.5um
Panel Outline Tol (+/-)	±0.004''(±0.1mm)
Beveling	30°45°
V-cut	15° 30° 45° 60°
Surface finish	HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate	ROHS  ISO9001:2000  TS16949  SGS  UL
Special requirements	Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger

We specilized in :   
Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic flow production line, auto panel plating line, auto P.T.H Line, and other precision production equipments and AOI testing machine, flying probe tester machine and other advanced detection equipments.

Production processes:
Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping



PCB assembly Equipment:
1. High speed and precision chip placer or multi-function SMD mounter
2. Wave soldering machine
3. Vacuum machine
4. High temperature box
5. Auto-solder paste printer
6. Hot- and mixed-air reflow

1. Components list
(a) Specification, brand, footprint
(b)To short the lead time, please kindly advise us if there is any acceptable components substitution.
(c) Schematic if necessary
2. PCB board information
(a) Gerber files
(b) PCB board processing technic
3. Testing Guide & Test Fixtures if necessary
4. Programming files & Programming tool if necessary
5. Package requirement

Why Choose Us?
1. Your inquiry related to our products or prices will be replied in 24hrs.

2. Well-trained and experienced staffs to answer all your enquires in fluent English

3. OEM&ODM,  we can help you to design and put into product.

4. Distributorship are offered for your unique design and some our current models

5. Protection of your sales area, ideas of design and all your private information

Our Markets

Trade Terms:
1. Payment: T/T in advance (Western Union , payple is welcomed)

2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.

3. Sample can be delivered in 3days

4. Shipping freight are quoted under your requests

5. Shipping port: Shen zhen,Mainland China

6. Discounts are offered based on order quantities

7. MOQ: 1PCS


Package &Shipping Methods:
1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement